With pleasure we invite all prospective authors to participate in 3rd IMAPS flash Conference 2017 which will be held at 9. - 10. November 2017 at Brno University of Technology, FEEC, Department of Microelectronics.
The conference will be organized by IMAPS CZ & SK in cooperation with FEEC Brno University of Technology, CEITEC and DPS journal. It will be thematically focused on areas that are related to the scope of the organizing company interest, ie. Microelectronics assembly, Packaging & 3D structures, Soldering & Chip attachment, Simulation & Testing, Sensors & Nanostructures.
(Foreign lectures will be translated to czech language)
There will be presented specialist lectures by leading experts from companies, focusing on microelectronics assembly evolving from PCB assembly and SMT as:
• Microelectronics Assembly
• Packaging & 3D Structures
• Soldering & Chip Attachment
• Simulation & Testing
• Sensors & Nanostructures
Based on the authors preference, the Scientific Committee recommendation and a standard journal reviewing procedure, the manuscript will be published after the conference in singular edition of Electroscope Journal (ISSN 1802-4564) and selected papers can be published in one of the following journals:
Microelectronics International (ISSN 1356-5362), impact factor 0,659
Journal of Electrical Engineering (ISSN 1335-3632), impact factor 0,483
Flash Presentation is defined as the speakers presentation with maximum of 10 slides and a maximum duration 12 minutes. After the presentation will be time for 1-2 questions from the audience.
The conference will feature specialized workshop:
Wirebonding semiconductor chips - Wirebonding with practical examples and the first publication about wirebonding in Czech and Slovak Republic.
General Chair: prof. Ing. Radimír Vrba, CSc.
director of Central European Institute of Technology
Prospective authors are kindly asked to send their abstract (2 pages A4 including text, 2 figures and 5 references - pleas use abstract template) via the conference email in Word for Windows file (*.rtf) or PDF (Acrobat) file.
IMAPS flash Conference abstract template is downloadable in this link: Abstract template
IMAPS flash Conference full paper template is downloadable in this link: Paper template
IMAPS flash Conference Registration form: Registration form
IMAPS flash Conference Copyright form: Copyright form
Abstract submision deadline: 18th August 2017 Submited abstracts will be reviewed by a peer-review committee.
Notification of acceptance: 25th August 2017 The presenting author will be notified of acceptance or rejection of her/his paper.
Camera-ready paper submission deadline and early registration: 12th October 2017
A – Přednášející/Presenters 140 EUR / 3700 Kč (proceedings, wirebonding publication, flash, gift, DPS od A do Z, galla dinner)
B – Účastník plné/Partecipants full 65 EUR / 1700 Kč (proceedings, wirebonding publication, flash, gift, DPS od A do Z, galla dinner)
C – Individuální člen IMAPS 50 EUR / 1300 Kč (proceedings, wirebonding publication, flash, gift, DPS od A do Z, galla dinner)
D – Účastník/Partecipants 35 EUR / 900 Kč (proceedings, flash, gift, DPS od A do Z)
Hotel Palacký , http://www.hotel-palacky.cz/ příjemné ubytování za skvělou cenu
Continental Brno , https://www.continentalbrno.cz