Technická 3058/10, 616 00 Brno

 +420 541 146 158

 szend@imaps.cz

Registration

 

Call for Abstracts

Czech Republic

With pleasure we invite all prospective authors to participate in 3rd IMAPS flash Conference 2017 which will be held at 9. - 10. November 2017 at Brno University of Technology, FEEC, Department of Microelectronics.

The conference will be organized by IMAPS CZ & SK in cooperation with FEEC Brno University of Technology, CEITEC and DPS journal. It will be thematically focused on areas that are related to the scope of the organizing company interest, ie. Microelectronics assembly, Packaging & 3D structures, Soldering & Chip attachment, Simulation & Testing, Sensors & Nanostructures.

(Foreign lectures will be translated to czech language)

There will be presented specialist lectures by leading experts from companies, focusing on microelectronics assembly evolving from PCB assembly and SMT as:

• Microelectronics Assembly
• Packaging & 3D Structures
• Soldering & Chip Attachment
• Simulation & Testing
• Sensors & Nanostructures

Based on the authors preference, the Scientific Committee recommendation and a standard journal reviewing procedure, the manuscript will be published after the conference in singular edition of Electroscope Journal  (ISSN 1802-4564) and selected papers can be published in one of the following journals:

Microelectronics International (ISSN 1356-5362), impact factor 0,659
Journal of Electrical Engineering (ISSN 1335-3632), impact factor 0,483

Flash Presentation is defined as the speakers presentation with maximum of 10 slides and a maximum duration 12 minutes. After the presentation will be time for 1-2 questions from the audience.

The conference will feature specialized workshop:

Wirebonding semiconductor chips - Wirebonding with practical examples and the first publication about wirebonding in Czech and Slovak Republic. 

General Chair:  prof. Ing. Radimír Vrba, CSc.      

director of Central European Institute of Technology  

 

 Brno, Czech Republic      Brno 

 

Our partners:

      Brno University of Technology       CEITEC       CEITEC          

         

 

Submission

The abstract

Prospective authors are kindly asked to send their abstract (2 pages A4 including text, 2 figures and 5 references - pleas use abstract template)  via the conference email in word Word for Windows file (*.rtf) or pdf PDF (Acrobat) file. 

Submit your abstract, Full paper, Registration and Copyright form by conference email: This email address is being protected from spambots. You need JavaScript enabled to view it.

IMAPS flash Conference abstract template is downloadable in this link: Abstract template

 

Full paper

IMAPS flash Conference full paper template is downloadable in this link: Paper template

IMAPS flash Conference Registration form: Registration form

IMAPS flash Conference Copyright form: Copyright form

 

Important Dates

 

Abstract submision deadline:   18th August 2017 Submited abstracts will be reviewed by a peer-review committee. 

Notification of acceptance:   25th August 2017 The presenting author will be notified of acceptance or rejection of her/his paper.  

Camera-ready paper submission deadline and early registration: 12th October 2017

 

Conference program

 

 

Fees

Fees:

A – Přednášející/Presenters                 140 EUR / 3700 Kč    (proceedings, wirebonding publication, flash, gift, DPS od A do Z, galla dinner)

B – Účastník plné/Partecipants full       65 EUR / 1700 Kč    (proceedings, wirebonding publication, flash, gift, DPS od A do Z, galla dinner)

C – Individuální člen IMAPS                    50 EUR / 1300 Kč     (proceedings, wirebonding publication, flash, gift, DPS od A do Z, galla dinner)

D – Účastník/Partecipants                        35 EUR / 900 Kč      (proceedings, flash, gift, DPS od A do Z)

 

 

 

 

Registration / Registrace


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